What Is SMT?

In this tutorial, we will show you what is SMT(surface mount technology).

SMT

SMT(electronic components) is the most advanced process and technology for components at present. Using traditional electronic technology to manufacture a small-scale, high-density, high-size, high-size miniaturized installation technology of product components, progress and production have also become automated.

The related components of miniaturization are called: chip devices. The process method for printing mobile phone components is called the SMT process. The component devices are called SMT devices.

At present, advanced electronic products, especially upper communication and electronic products, generally adopt SMT , and the output of SMD devices is increasing year by year.

Using Surface Mount Technology (SMT)?

1. Electronic products pursue miniaturization.

2. The functions of electronic products are more complete, and the leadless components used, especially advanced integrated circuits, must use surface mount components.

3. Product production automation. Manufacturers use volume, production volume, high output, and necessary products to win market demand and win praise.

4. The development trend of electronic applications, the characteristics of integrated circuits and semiconductor materials.

5. The technology that will inevitably appear in the progress and development of electronic technology.

SMT Technology and Characteristics

SMT is a PCB component technology, through which SMD (Surface Mount Device) can be installed on the surface of the PCB through some technologies, equipment and materials, as well as soldering, cleaning and testing, and the components can be pasted.

SMT technology can be divided into different types according to the way of welding and assembly.

Depending on the welding method, technology can be divided into weld and wave weld classes.

It is understood that SMT technology can be divided into three categories: full-surface components, single-sided combined components and double-sided hybrid components.

Basic Process Components

Screen Printing –> Placement Repair –> Weld Seam –> Cleaning –> Inspection –> Repair

SMT Related Technology Portfolio

1. Electronic product and integrated circuit design and manufacturing technology

2. Circuit design technology of electronic products

3. Manufacturing technology of circuit boards

4. Design and manufacturing technology of automatic placement equipment

5. Manufacturing process technology of circuit components

6. Development and production technology of auxiliary materials for assembly manufacturing

Introduction to SMT

SMC: Surface Mount Components

Rectangular chip components, cylindrical chip components,

composite chip components, special-shaped chip components.

SMD: Surface Mount Device

Integrated circuits include SOP, SOJ, C, LCCC, QFP, BGA, CSP, FC, MCM, etc.

E.g

1. PCB connection board: Provides mechanical and electrical connections, including connection and actual installation/connection wires, brackets, motherboards, surface connections to PCB connections.

2. There are electronic components (AcTIve: in analog or digital circuits, you can control the voltage and current yourself to generate your source switch), that is, the basic characteristics of the signal change that you can apply. Passive electronic components (InacTIve): do not change their characteristics when an electrical signal is applied, i.e. provide a simple, repeatable response.

3. Special-shaped electronic components: their geometrical factors are peculiar, but not necessarily unique. Therefore, it must be hand mounted, and its housing (in contrast to its basic function) shape is non-standard, such as: many transformers, hybrid circuit structures, fans, mechanical switch blocks, etc.

Chip resistors, capacitors, etc. Size specifications: 0201, 0402, 0603, 0805, 1206, 1210, 2010, etc.

Tantalum capacitors, size specifications: TANA, TANB, TANC, TANDSOT transistors, SOT23, SOT143, SOT89, etc.

melf cylindrical components, diodes, resistors etc.

SOIC integrated circuits, size specifications: SOIC08, 14, 16, 18, 20, 24, 28, 32

QFP Fine Pitch IC PLCC IC, PLCC20, 28, 32, 44, 52, 68, 84

BGA ball grid array packaging integrated circuit, array pitch specification: 1.27, 1.00, 0.80

CSP integrated circuit, the side length of the component does not exceed 1.2 times the side length of the chip inside, the microBGA with the array pitch <0.50

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Kei Lin

Editor-in-Chief of Wonderful PCB, enjoys writing and telling stories about power electronics, wide bandgap semiconductors, automotive, IoT, digital, energy and quantum. Currently the editor-in-chief of Wonderful PCB and Wonderful Chip, a podcast about power electronics.