Types of Vias
First of all, the circuit board is formed by superimposing layers of copper foil circuits, and the connection between different circuit layers relies on vias.
Vias can be divided into two categories:
Is for electrical connections between layers.
It is used for fixing or positioning the device.
In terms of process, these holes are generally divided into three categories, namely blind holes, buried holes, and through holes.
Hole Type
The hole type is generally divided into plane hole type and cross-section hole type.
(1) The plane hole type is mainly judged by the roundness index.
(2) For the cross-section hole type, a destructive test must be carried out, and the slices must be taken for observation and measurement. The main indicators are taper, hole wall roughness, and the degree of damage to the copper of the substrate.
Copper Plating Condition
The key indicators to measure the copper plating condition are corner copper thickness, hole wall copper thickness, hole filling height (bottom copper thickness), dimple value, etc.
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