In 1961, multilayer PCB was born in the United States.
After Japan set foot in this field in 1963, various ideas and manufacturing methods related to multilayer PCB gradually became popular all over the world.
Manufacturing method
At the beginning, the multilayer PCB was disclosed in three manufacturing methods: the gap method, the build-up method, and the through-plating method.
The meso-hole method has not been put into practical use because it takes a lot of time to manufacture and there is a limit to increasing the density.
Direction of development
With the progress of VLSI, the miniaturization and high integration of electronic components, multilayer PCB is moving towards the direction of high-function circuits. Therefore, the demand for high-density lines and high wiring capacity is increasing, and there is also a joint demand for electrical characteristics. The requirements are more stringent.
The prevalence of multi-pin parts and surface mount components makes the shape of the circuit pattern of the multilayer PCB more complex, and the conductor lines and apertures are smaller.
After 1980, in order to meet the high-density wiring and small hole trend required for small size and light weight, thin multilayer boards with a thickness of 0.4~0.6 mm gradually became popular.
Complete the guide hole and shape of the part by punching. In addition, some products that are produced in small quantities and in various quantities use the photographic method of forming patterns with photoresists.
High Power Amplifier – Substrate: ceramic + FR-4 plate + copper base, number of layers: 4 layers + copper base, surface treatment: immersion gold, features: ceramic + FR-4 plate mixed lamination, with copper base bonding.
Military high-frequency multilayer pcb – base material: PTFE, board thickness: 3.85mm, number of layers: 4 layers, features: blind buried vias, silver paste filled vias.
Green products- Substrate: Environmentally friendly FR-4 sheet, thickness: 0.8mm, number of layers: 4 layers, size: 50mm×203mm, line width/spacing: 0.8mm, hole diameter: 0.3mm, surface treatment: immersion gold, Shen tin.
High frequency, high Tg device – base material: BT, number of layers: 4 layers, plate thickness: 1.0mm, surface treatment: chemical gold.
Embedded System – Substrate: FR-4, Number of Layers: 8, Board Thickness: 1.6mm, Surface Treatment: HASL, Line Width/Space: 4mils/4mils, Solder Mask Color: Yellow.
DCDC, Power Module – Substrate: High Tg Thick Copper Foil, FR-4 Sheet, Size: 58mm×60mm, Line Width/Space: 0.15mm, Aperture: 0.15mm, Board Thickness: 1.6mm, Number of Layers: 10 , Surface treatment: immersion gold, features: each layer of copper foil thickness 3OZ (105um), blind buried hole technology, high current output.
High-frequency multilayer board – base material: ceramic, number of layers: 6 layers, board thickness: 3.5mm, surface treatment: immersion gold, feature: buried via.
Photoelectric conversion module – substrate: ceramic + FR-4, size: 15mm×47mm, line width/space: 0.3mm, aperture: 0.25mm, number of layers: 6 layers, board thickness: 1.0mm, surface treatment: gold plating+ Gold finger, features: embedded positioning.
Backplane – base material: FR-4, number of layers: 20 layers, board thickness: 6.0mm, outer layer copper thickness: 1/1 ounce (OZ), surface treatment: immersion gold.
Micro-module – Base material: FR-4, number of layers: 4 layers, board thickness: 0.6mm, surface treatment: immersion gold, line width/space: 4mils/4mils, features: blind vias, semi-conducting vias.
Communication Base Station – Substrate: FR-4, Number of Layers: 8, Board Thickness: 2.0mm, Surface Treatment: HASL, Line Width/Space: 4mils/4mils, Features: Dark Solder Mask, Multiple BGA Impedance Control.
Data Collector – Substrate: FR-4, Number of Layers: 8, Board Thickness: 1.6mm, Surface Treatment: ENIG, Line Width/Space: 3mils/3mils, Solder Mask Color: Green Matte, Feature: BGA , Impedance control.
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