Most Should Know about Buried Via Technology
A buried hole is a connection between any circuit layers inside the printed circuit board, but it is not connected to the outer layer, and each connected hole must be defined as a separate drilling file.
The ratio of hole diameter to hole depth must be 1:12 or greater, with the smallest hole determining the depth and thus the largest distance between individual inner layers.
This manufacturing process cannot be achieved by bonding the circuit boards and then drilling them. The drilling operations must be performed at the individual circuit layers.
First, the inner layer is partially bonded, and then electroplating is performed, and finally, all the bonding is performed. Since the operation process is more laborious than the original via and blind vias, the price is also the most expensive. This fabrication process is usually only used for high-density circuit boards, increasing the space utilization of other circuit layers.
Advantages of Buried Vias
In the non-through-via technology, the application of buried vias can greatly reduce the size and quality of the PCB, reduce the number of layers, improve electromagnetic compatibility, increase the characteristics of electronic products, reduce costs, and make the design work easier and faster.
In traditional PCB design and processing, through holes pose many problems, they use a lot of available space. Secondly, a large number of through-hole dense places also cause obstacles to the inner layers of multi-layer PCBs.
These vias take up the space required for traces, they pass densely through the surface of the power and ground layers, and they also destroy the impedance characteristics of the power ground layer, making the power ground layer ineffective. And conventional mechanical drilling will be several times the workload of using non-penetrating hole technology.
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